Superb performace, maximizing the heat trasfer between the heatsink and processor.
Thermal Conductivity of 11.2 W/m-°C
Thermal Impedance of 0.013°C-in2/W
Excellent long term stability with low dry-out. High thermal conductivity with low thermal impedance. Non-corrosive and electrically non-conductive. No "burn-in" time required.
One 30 gram syringe and easy-to-spread applicator.
Pk-3 Nano Aluminum Thermal Compound is a state of the art cooling compound. Using nano sized aluminum particles, Pk-3 fills in small air bubbles and gaps between the heatsink and processor, maximizing contact and heat transfer. It offers incredible performance for those seeking to gain the greatest cooling gains in their systems.
FEATURES - High Thermal Conductivity
- Low Thermal Resistance
- Long-Term Stability
- Low Dry-Out
- Non-Corrosive
- Electrically Non-Conductive
- No "burn-in" Time Required