AVNTKER 100x100x1.5mm Thermal Pad 12 W/mK High Thermal Conductivity Heatsink Silica Gel Heat Conduction Pad Alternative to Thermal Paste for Cooling CPU, GPU, SSD, Drive, VGA, HDD, VRAM, 3D Printer

Scope Application:

For the control of electronic products, motherboard, motor, external pad and foot pad, electronic appliances,high power LED lighting,Car machine, 

computer host, power devices, automotive electronic modules (engine scrubber) Power modules, 

high power power supplies, calculator applications (CPU, GPU, USICS, hard drives) ,laptop, DVD, VCD And more electronic equipment.

You can according to the size of the gap between the heating element and the heat sink to select the appropriate thickness of the thermal silica Pad, the size of the self-cutting.

Specifications:

Model:AK400

Size:100x100 mm / Thickness: 1.5mm

Thermal Conductivity: 6.0 W/m K 

Working temperature: -40~200 °C 

Why use thermal silica film, with thermal silicone film What are the benefits and advantages?

1) The main purpose of the choice of thermal silicone film is to reduce the heat source surface and the heat dissipation device contact 

surface between the contact thermal resistance,Thermal conductivity of silicone film can be good filling the gap between the contact surface;

2) because the air is hot bad conductor, will seriously hinder the heat transfer between the contact surface,

And in the heat source and the radiator between the installation of thermal silica film can be out of the air contact surface;

3) with thermal silicone film supplement, you can make the heat source and the heat sink between the contact surface better full contact,

Truly face to face contact in the temperature of the reaction can be achieved as small as possible temperature difference.

Package included:

1* 100x100x1.5 mm Thermal Pad