GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance
R 633
or 4 x payments of R158.25 with
Availability: Currently in Stock
Delivery: 10-20 working days
GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance
Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively.
Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
It has good thermal conductivity and wide service temperature range(-60~280 degrees Celsius)
Thermal conductivity:> 1.5W/m-K, Do not use thermal glue "between CPU and HEATSINK"!
Package Includes : 1 x GENNEL G109 10g thermal glue
* 100% New Heatsink plaster. * Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink,VGA CARD Northbridge Southbridge Heatsink. * Features: thermal properties, strong adhesion * Melting capacity: 0 (200 ℃ / 24Hours) * Evaporation: 0.001% (200 ℃ / 24Hours) * Thermal conductivity:> 1.2W/m-K * Thermal Impedance: <0.06 * Clotting time: 3min (25 ℃) * Strength of connected buildings: 25Kg * Insulation coefficient> 5.1 * Dissipation coefficient <0.005 * Temperature resistance: 200 ℃ * Net Weight: 10g
Do not use thermal glue between CPU Chip and heatsink
Package Includes: 1 x Thermal Heatsink Plaster Glue.