Thermal Pad,200x200x0.5mm 6W/m.k Thermal Conductivity,with

Thermal Pad,200x200x0.5mm 6W/m.k Thermal Conductivity,with Good efficient Heat Dissipation Performance,for Laptop Heatsink/CPU/GPU/SSD/IC/LED Cooler
- ✔Good Heat Dissipation：Perfect To Filled Contact Surfaces Gap, effectively improve the heat transfer efficiency, improve the heat transfer between the CPU / chipset / motherboard / module and the heat sink, and also serve as insulation, shock absorption and sealing Equal effect.
- ✔Application：Thermal Pad used in the control board of electronic and electrical products;Pads and foot pads inside and outside the motor; Appliances, automotive machinery, computer hosts, notebook computers, DVDs, VCDs, and any materials that require filling and cooling modules.
- ✔Good Cooling, Insulation, Thermal Conductivity, Wear Resistant, Non Conductive, Antistatic,Fire Retardant, Heat Resistance, High Temperature Resistance, Compression, Buffering, Etc.
- ✔In -40 ℃ -200 ℃ Range Does Not Melt, Good Stability, No Toxic, Odorless,No Corrosion,No Stimulation,No Damage To Metal Materials.It Can Be Arbitrarily Cut Size,Easy To Install, Replaces Traditional Heatsink Compound Grease Paste.
- ✔Thermal Silicone Pad Has A Thermal Conductivity Of 6 W/mk, It Is The Most Conductive Thermal Pad On The Market,Thickness Is Widely Used, But It Is Not Very Sticky, It Can Be Glued With Thermal Double Sided Tape, Please Search (B075FR45DV), This Is The Thermal Adhesive Tape We Sell, You Can Apply These Two Different Products Together To Your Electronic Device, Realize The Best Thermal Conductivity.
Main Features:
thermal pad has 6.0 W/m K Thermal Conductivity, Used to fill the gap between the heating element and the Heatsink, Achieve the best cooling effect,
At the same time, the thermal pad also has Insulation, Non-conductive, wear-resistant, fire-retardant, compression, buffering, no damage to metal materials, etc effect.

Why use thermal silicone Pad ?
1) The main purpose of the choice of Thermal Pad is to reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance,
Thermal conductivity of silicone Pad can be good filling the gap between the contact surface;
2) because the air is hot bad conductor, will seriously hinder the heat transfer between the contact surface,
And in the heat source and the radiator between the installation of thermal silica Pad can be out of the air contact surface;
3) with thermal silicone Pad supplement, you can make the heat source and the heat sink between the contact surface better full contact,
Truly face to face contact in the temperature of the reaction can be achieved as small as possible temperature difference.

Applicable industry:
LED industry, automotive electronics industry, power industry, PDP/LED flat-panel TV,
communications industry, Industrial industry, household electrical appliance industry.

Scope Application:
electronic products, motherboard, motor, external pad and foot pad, electronic, appliances,high power LED lighting,Car machine,
power devices, automotive electronic modules (engine scrubber) Power modules,
high power power supplies, computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives) ,laptop and any electronic equipment needing to be filled with heat dissipation

Package included:
1* 200x200x0.5 mm Thermal Pad

Country	USA
Brand	AI AIKENUO
Manufacturer	AI AIKENUO
Binding	Electronics
ItemPartNumber	4352386869
Model	4352386869
Color	200x200x0.5mm 6W/m.k
Size	200x200x0.5mm 6W/m.k
UnitCount	2
EANs	6906755514356
ReleaseDate	0000-00-00

Thermal Pad,200x200x0.5mm 6W/m.k Thermal Conductivity,with Good efficient Heat Dissipation Performance,for Laptop Heatsink/CPU/GPU/SSD/IC/LED Cooler

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