Computers & Accessories

Computer Components

Internal Components

2Pcs Pure Copper Heatsink 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm Heat Sink for Electronic 3D Printer CHIP IC MOS Heat Dissipation

R 1,010

or 4 x payments of R252.50 with Payflex

Payflex

Availability: Currently in Stock

Delivery: 10-20 working days

This item may be available in a different size, colour, scent, version or platform:

Variations

2Pcs Pure Copper Heatsink 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm Heat Sink for Electronic 3D Printer CHIP IC MOS Heat Dissipation
- Absorb Heat Quickly -- Made of pure copper , the thermal conductivity up to 401W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum.
- Heatsink Exteral Size: 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm. Widely used for Electronic, CHIP, 3D printer, MOS, IC computer 's component, etc.
- Skiving Fins Process -- This creates more surface area and opportunity for heat dissipation.
- Preventing Overheating -- Heat sink sucks the heat away that can reduce the risk of hardware failure due to overheating.
- Thermal Conductive Adhesive Tape Included -- You can use the thermal pad adhesive and bond this to whatever you need to cool.
Country USA
Brand Jeteokar
Manufacturer Jeteokar
Binding Unknown Binding
ItemPartNumber 2P-JR221-US
Model 35x35x7mm
Color Copper
UnitCount 1
UPCs 743447008863
EANs 0743447008863
ReleaseDate 0000-00-00