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3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)
Sold Out / Out of Stock
3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)
Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
ItemPartNumber
45539203
EANs
9783319445847
ReleaseDate
0000-00-00