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AMTECH NC-559-V2 no-clean tacky solder flux (10g)
ROL0 flux classification - rosin based, low activity no-clean tacky solder flux for professional/industrial use. Highly praised by advanced reworks community for mighty long-lasting action and easy cleaning - clear residue evaporates with hot air and doesn't short components. Applicable for a syringe, stencil printing, rework, BGA sphere attachment and reballing using standard tin/lead alloys (not designed for lead-free). Halide-free (<0.05%). Contains UV-tracer for fast detection of splatter
Optimal viscosity - 40-52 (Malcom @ 10 RPM/25°C (x103mPa/s)). High temperature compatible (up to 300°C/600°F). Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop).
Wide process window - excellent performance on Flip Chip bumping and Chip Scale packaging sites. Activated residue is clear and non-corrosive - can be left on board for multiple SMT assemblies (manufacturer recommends cleaning all flux residues at all times to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion).
Packaged in various sizes of jars, syringes and cartridges.
Genuine product made in the USA by AMTECH MANUFACTURING LLC. Every original shipment would include AMTECH Soldering Profiles card. This product is high-temperature compatible.