Aluminum Heat Sink Heatsink Module Cooler Fin for High Power

Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Amplifier Transistor Semiconductor Devices with Dense 19 pcs Fins 11.8"(L) x 5.51"(W) x 0.79"(H) / 300 mm (L) x 140 mm (W) x 20 mm (H)
- Material: Made of high-quality aluminum with good thermal conductivity.
- Features: Reduce the risk of hardware failure due to overheating.
- Maximized surface area design: The maximized surface area design is in contact with the cooling air. 19 heat sinks increase the area of the circuit board, thereby providing greater heat transfer.
- Applicable: Designed for high-power household LED lights or fish tank LED devices, etc.
- Note: Please make sure the size of the heat sink is suitable for your component.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

Specifications:
100% Brand New High Quality
Material: Aluminum
Fins: 19
Size: 11.8"(L) x 5.51"(W) x 0.79"(H) / 300 mm (L) x 140 mm (W) x 20 mm (H)
Quantity: 1
Weight: 157g (approx.)
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Package:
1x Aluminum Heat Sink Cooling Fin
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Note:
1. Â Â Â Please check the specification table and make sure that the size of the heatsink fits that of your component. Thank You!
2. Â Â Â Please allow 1-3mm error due to manual measurement. Thanks for your understanding.
3. Â Â Â Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.
Country USA
Brand Walfront
Manufacturer walfront
Binding Misc.
ItemPartNumber 43272-950
Model NA
UPCs 736691271961
EANs 0736691271961
ReleaseDate 0000-00-00

Country	USA
Brand	Walfront
Manufacturer	walfront
Binding	Misc.
ItemPartNumber	43272-950
Model	NA
UPCs	736691271961
EANs	0736691271961
ReleaseDate	0000-00-00

Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Amplifier Transistor Semiconductor Devices with Dense 19 pcs Fins 11.8"(L) x 5.51"(W) x 0.79"(H) / 300 mm (L) x 140 mm (W) x 20 mm (H)

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