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Microelectronics

Chemical Mechanical Planarization of Semiconductor Materials

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Chemical Mechanical Planarization of Semiconductor Materials

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Country	USA
Binding	Hardcover
Brand	Brand: Springer
Creator	M.R. Oliver
EAN	9783540431817
Edition	2004
Feature	Used Book in Good Condition
ISBN	9783540431817
IsEligibleForTradeIn	1
Label	Springer
Manufacturer	Springer
MPN	298 black & white illustrations
NumberOfItems	1
NumberOfPages	428
PartNumber	298 black & white illustrations
PublicationDate	2004-03-19
Publisher	Springer
Studio	Springer
ReleaseDate	0000-00-00

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