DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS (WSPC Series in

DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS (WSPC Series in Advanced Integration and Packaging, 2)

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Country USA
Brand World Scientific Publishing Company
Manufacturer World Scientific Pub Co Inc
Binding Hardcover
UnitCount 1
EANs 9789814508599
ReleaseDate 0000-00-00

Country	USA
Brand	World Scientific Publishing Company
Manufacturer	World Scientific Pub Co Inc
Binding	Hardcover
UnitCount	1
EANs	9789814508599
ReleaseDate	0000-00-00

DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS (WSPC Series in Advanced Integration and Packaging, 2)