■Aluminum nitride ceramic substrate has very good thermal conductivity, is currently one of the best thermal conductivity materials in the field of thermal conductivity, aluminum nitride ceramics have excellent thermal conductivity (7-10 times of alumina ceramics), low dielectric constant and dielectric loss, reliable insulation properties, excellent mechanical properties
■AIN crystals have a wurtzite type structure and are hexagonal crystal system with the structure of AIN4 tetrahedron as the covalent bond compound.
■Chemical composition AL 65.81%,N 34.19%, specific gravity 3.261g/cm3, white or off-white, single crystal colorless and transparent, the sublimation decomposition temperature at atmospheric pressure is 2450℃. It is a high temperature heat resistant material with thermal expansion coefficient (4.0-6.0)X10(-6)/℃.
■The thermal conductivity of polycrystalline AIN is 260W/(m.k), 5-8 times higher than that of alumina, so it is good at heat shock resistance and can withstand extreme heat at 2200℃.
■Aluminum nitride is resistant to aluminum liquid and other molten metals and gallium arsenide, especially to molten aluminum liquid has excellent corrosion resistance.