Gelid Solutions GC-4-1g Thermal Compound for Heat Sinks

Gelid Solutions GC-4-1g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive
- Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications.
- Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C
- Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity.
Country USA
Brand Gelid Solutions
Manufacturer Gelid Solutions
Binding Electronics
ItemPartNumber TC-PARENT-US
Model TC-GC-04-A
Size 1g
EANs 4897025783690
ReleaseDate 0000-00-00

Gelid Solutions GC-4-1g Thermal Compound for Heat Sinks | Maximum Thermal Conductivity | Easy to use | Non-Corrosive