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Halnziye 10Gram Thermal Conductive Glue Silicone Plaster Viscous Adhesive Cooling Compound for LED GPU Chipset Heatsink

R 648

or 4 x payments of R162.00 with Payflex

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Availability: Currently in Stock

Delivery: 10-20 working days

Please be aware orders placed now may not arrive in time for Christmas, please check delivery times.

Halnziye 10Gram Thermal Conductive Glue Silicone Plaster Viscous Adhesive Cooling Compound for LED GPU Chipset Heatsink
- Do Not Use Thermal Glue Between CPU Chip And Heat Sink, use it within 24 hours once opened.
- Thermal conductivity:> 1.2W/m-K
- Strength of connected buildings: 55 lb.
- Features: thermal properties, strong adhesion
- Application: apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET Heatsinkï VGA CARD Northbridge Southbridge Heatsink.
* Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink, VGA CARD Northbridge Southbridge Heatsink.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (200°C/392°F / 24Hours)
* Evaporation: 0.001% (200°C/392°F / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25°C/77°F
* Strength of connected buildings: 25Kg/55Lb
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200°C/392°F
* Net Weight: 10g

Do Not Use Thermal Glue Between CPU Chip And Heat Sink
Country USA
Brand Halnziye
Manufacturer Halnziye
Binding Personal Computers
ItemPartNumber HY910-T10
Model HY910-T10
Color clear
Size HY910 - 10g
ReleaseDate 0000-00-00

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