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Computers & Technology

Handbook of 3D Integration: Volumes 1 and 2 - Technology and Applications of 3D Integrated Circuits

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Handbook of 3D Integration: Volumes 1 and 2 - Technology and Applications of 3D Integrated Circuits

The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics
into perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbook
presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging
technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration
to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in
detail. This is followed by fields of application and a look at the future of 3D integration.

The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon,
Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.

Country	USA
Binding	Paperback
EAN	9783527332656
Edition	1
ISBN	3527332650
IsEligibleForTradeIn	1
Label	Wiley-VCH
Manufacturer	Wiley-VCH
MPN	Illustrations (some col.)
NumberOfItems	1
NumberOfPages	799
PartNumber	Illustrations (some col.)
PublicationDate	2012-10-22
Publisher	Wiley-VCH
Studio	Wiley-VCH
ReleaseDate	0000-00-00

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