【application】 The wire solder paste is suitable for the rework of mobile phone PCB, BGA and PGA and other SMDs. The soldering speed is fast, and the surface insulation resistance value after the residue is cured is high. Therefore, it has little electrical interference to mobile phone and other communication products.
【need to clean up】 NC-559-ASM is a high-attachment solder paste with strong adhesion and less smoke during operation. It needs to be cleaned after use.
【note】 Please pay attention to avoid contact with water, acid and alkali, water solubility (%) 0.002. Adapt to 50-60 temperature.
【easy to use】 The BGA solder paste is a syringe design and comes with 10 pins, so soldering is not wasted.
【solder paste】 Syringe type flux is light yellow paste, odorless and non-irritating, and its main component is rosin synthetic resin.