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Soldering & Brazing Equipment

KELLYSHUN Sn42% Bi58% Solder Paste,(30g) No Clean Solder Paste,Electronic Soldering Paste with Flux,For SMT BGA Phone IC LED

R 576

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KELLYSHUN Sn42% Bi58% Solder Paste,(30g) No Clean Solder Paste,Electronic Soldering Paste with Flux,For SMT BGA Phone IC LED
- Solder Paste Content: Alloy Tin 42% Bi58%, total weight - 30g, net weight of solder paste - 22g.
- Solder Paste Melting Point:138℃ solder paste can be used for soldering products that are not resistant to high temperatures.
- Push Rod Design: The push Rod design allows for precise control of Solder Paste release, minimizing waste during the soldering process.
- Lead Free Solder Paste Application Widely:SMD/PCB/CPU/IC/BGA/LED/TV/Phone/Computer/Household Appliances/Industrial Equipment Maintenance Welding.
- Advantages of Solder Paste: Lead-Free Solder, Rosin Solder Paste, ensuring smooth flow, creating firm solder joints, and providing a bright finish
Country USA
Brand KELLYSHUN
Manufacturer KELLYSHUN
Binding Misc.
Model 138℃ Solder Paste
UnitCount 1
ReleaseDate 0000-00-00