Loctite 401 Super Glue Instant Adhesive -20G - Sticks Metal, Rubber, Ceramic General Purpose. Low Viscosity. Ideal for Use On Porous Substrates.
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Loctite 401 Super Glue Instant Adhesive -20G - Sticks Metal, Rubber, Ceramic General Purpose. Low Viscosity. Ideal for Use On Porous Substrates.
LOCTITE 401 is designed for the assembly of difficult to-bond materials which require uniform stress distribution and strong tension and/or shear strength. The product provides rapid bonding of a wide range of materials, including metals, plastics and elastomers. LOCTITE 401 is particularly suited for bonding porous or absorbent materials such as wood, paper, leather and fabric. TYPICAL CURING PERFORMANCE Under normal conditions, the atmospheric moisture initiates the curing process. Although full functional strength is developed in a relatively short time, curing continues for at least 24 hours before full chemical/solvent resistance is developed.
Reactions for use 1. Bond areas should be clean and free from grease. Clean all surfaces with a Loctite cleaning solvent and allow to dry. 2. Loctite Primer may be applied to the bond area. Avoid applying excess Primer. Allow the Primer to dry. 3. LOCTITE Activator may be used if necessary. Apply the LOCTITE Activator to one bond surface (do not apply activator to the primed surface where Primer is also used). Allow the Activator to dry. 4. Apply adhesive to one of the bond surfaces (do not apply the adhesive to the activated surface). Do not use items like tissue or a brush to spread the adhesive. Assemble the parts within a few seconds. The parts should be accurately located, as the short fixture time leaves little opportunity for adjustment. 5. LOCTITE Activator can be used to cure fillets of product outside the bond area. Spray or drop the activator on the excess product. 6. Bonds should be held fixed or clamped until adhesive has fixture. 7. Product should be allowed to develop full strength before subjecting to any service loads (typically 24 to 72 hours after assembly, depending on bond gap, materials and ambient conditions).