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Thermal Paste & Pads

Net Weight 30 Grams Syringe with Bag Packaging Gray GD900 Thermal Conductive Grease Paste Silicone Compound Heat Sink Cooler BX30 (GD900-BX30*1 Piece)

R 875

or 4 x payments of R218.75 with Payflex

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Availability: Currently in Stock

Delivery: 10-20 working days

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Net Weight 30 Grams Syringe with Bag Packaging Gray GD900 Thermal Conductive Grease Paste Silicone Compound Heat Sink Cooler BX30 (GD900-BX30*1 Piece)
- [EXCELLENT THERMAL CONDUCTIVITY]: GD900 thermal paste conductivity is 4.8 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated. It has excellent temperature reduction performance.
- [SAFETY APPLICATION]: The practical syringe ensures effortless application of thermal paste exactly where it needs to be. Perfect for CPU, cooling, GPU, LEDs, and heat sink fins.
- [NON-CONDUCTIVE]: It is also not electrically conductive : there is no risk of short-circuits and safe to use with all types of heatsinks.
- [ASSISTING TOOLS]: We provide tools including wet wipe, finger cots and a scraper to help you remove original thermal compound and apply our paste comfortably.
- [EASY TO USE]: Convenient for application and storage. the paste is not stiff and comes with a scraper, the moderate viscosity can be easily smeared evenly, so that all beginners can easily apply it.

Country	USA
Brand	Generic
Manufacturer	Foshan High Conductivity Electronics Co., Ltd.
ItemPartNumber	GD900
Model	GD900-BX30*1
Color	GD900-BX30*1 Piece
UnitCount	1
UPCs	700600860027
EANs	0700600860027
ReleaseDate	0000-00-00