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Soldering & Brazing Equipment

Solder Paste(Sn64Bi35Ag1), Silver Tin Paste (30g), No-Clean Soldering Paste For Electronics Soldering by Essmetuin

R 819

or 4 x payments of R204.75 with Payflex

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Availability: Currently in Stock

Delivery: 10-20 working days

Solder Paste(Sn64Bi35Ag1), Silver Tin Paste (30g), No-Clean Soldering Paste For Electronics Soldering by Essmetuin
- Lead-Free Solder Paste Content: Tin 64% Bi 35%Ag1%, Solder Flux Content: 10.0%
- Electronics Soldering Paste - Low Temperature Solder Paste With Flux, Melting Point: 183 ℃ (361F)
- Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding
- Suitable For Paper Boards Or Soft Boards That Cannot Withstand High Temperatures, Special Welding Of Small Components
- Widely Used In BGA /SMD Circuit Board, Motors, Lighting, IC, TV and Other Household Appliances And Electronics Soldering Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, ,SMT Maintenance
Country USA
Brand Essmetuin
Manufacturer ZHUOBAO
Binding Misc.
Model ZB-SBA30
Size Sn64Bi35Ag1
ReleaseDate 0000-00-00