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Thermal Paste & Pads

T-Global Technology Thermal Paste 6.3 W/mK 55ml, TG-6060 Silicone-Type Putty, Gel Between Liquid and Solid State, with Dispenser, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU

R 5,438

or 4 x payments of R1,359.50 with Payflex

Payflex

Availability: Currently in Stock

Delivery: 10-20 working days

T-Global Technology Thermal Paste 6.3 W/mK 55ml, TG-6060 Silicone-Type Putty, Gel Between Liquid and Solid State, with Dispenser, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU
- THERMAL CONDUCTIVITY-quality thermal paste with 6.3walt/ thermal conductivity which can meets the requirements of low-end anti-heat and belongs to the low-end flagship thermal putty.
- EXCELLENT PERFORMANCE-Temperature: -50-180° . It optimizes the heat dissipation performance of the product also it has an ultra-low heat group.
- FLEXIBLY DESIGN-This thermally conductive mortar is paste-like paste stickers, product design does not need to take special consideration of product size and tolerance restrictions
- VERSATILE APPLICATIONS-5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive,Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
- 100% SATISFACTION - Feel free to contact us if you have any question or mass order demand, we care customers and make sure 100% satisfaction customer service reply within 24 hours.
Country USA
Brand T-Global
Manufacturer T-Global Technology
Binding Personal Computers
ItemPartNumber TG-6060 Putty-55ml
Color Blue
ReleaseDate 0000-00-00