T-Global Technology Thermal Paste 9.0 W/mK 30g, TG-N909 Non-Silicone Grease, Spacer, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU
R 669
or 4 x payments of R167.25 with
Availability: Currently in Stock
Delivery: 10-20 working days
T-Global Technology Thermal Paste 9.0 W/mK 30g, TG-N909 Non-Silicone Grease, Spacer, Thermal Gel Between Liquid and Solid State, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU
EXCELLENT THERMAL CONDUCTIVITY-Thermal Paste conductivity 9.0 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated.and subsequently excellent temperature reduction performance
HIGH DURABILITY-The non-silicone thermal Heatsinks paste Low thermal resistance can keep mushy for a long time. Wide operating temperature range, stable performance under -40℃-200℃ environment. High heat dissipation performance, high-cost performance. It will not compromise over time.
EASY TO USE-Thermal paste has ideal consistency and is very easy to use even for beginners;it is also not electrically conductive : there is no risk of short-circuits and safe to use with all types of heatsinks
SAFETY APPLICATION-It has low thermal resistance and suitable for CPU radiator or chip. and high conductivity can achieve excellent heat transfer. Suitable for CPU, VGA, chipset, and other PC components.
100% SATISFACTION - Feel free to contact us if you have any question or mass order demand, we care customers and make sure 100% satisfaction customer service reply within 24 hours.