☰

Tools & Home Improvement

Welding & Soldering

Welding Equipment

Welding Equipment & Accessories

Tin Balls BGA L ead, 0.6mm Solder Ball Tin Shpere 25W for PCB Board Soldering Reballing Accessories

R 2,919

or 4 x payments of R729.75 with Payflex

Payflex

Availability: Currently in Stock

Delivery: 10-20 working days

Please be aware orders placed now will not arrive in time for Christmas, please check delivery times.

Tin Balls BGA L ead, 0.6mm Solder Ball Tin Shpere 25W for PCB Board Soldering Reballing Accessories
- Mainly used to connect semiconductor wafers, circuit templates and PCB boards, and transmit electronic SIG NALS with ultra‑small spherical tin electronic parts.
- Environmentally friendly l ead‑FR EE, refined materials, strengthened solder ball soldering capabilities
- Add trace elements to the solder balls to improve the oxidation ability and reliability of the solder balls
- The diameter of the solder ball for IC packaging is approx. 0.2 ~ 0.76mm / 0.01 ~ 0.03in.
- A large number, can meet your use and replacement needs, very practically.
Country USA
Brand XTevu
Manufacturer XTevu
ItemPartNumber XTevuv1bai8wzhm
Model XTevuv1bai8wzhm
Color #511
UnitCount 1
ReleaseDate 0000-00-00